3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot,

By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)

Back disguise reproduction sequence: built-in Circuits and structures 3D-Integration for NoC-based SoC Architectures by means of: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This ebook investigates at the provides, demanding situations, and strategies for the 3D Integration (vertically stacking) of embedded structures hooked up through a community on a chip. It covers the total architectural layout technique for 3D-SoCs. 3D-Integration applied sciences, 3D-Design options, and 3D-Architectures have emerged as issues severe for present R&D resulting in a vast variety of goods. This booklet provides a entire, system-level evaluate of third-dimensional architectures and micro-architectures. •Presents a entire, system-level review of 3-dimensional architectures and micro-architectures; •Covers the total architectural layout procedure for 3D-SoCs; •Includes state of the art remedy of 3D-Integration applied sciences, 3D-Design ideas, and 3D-Architectures.

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3 we become more concrete by assuming specific system sizes and frequencies. This allows for analyzing performance limits under power, frequency and area constraints. 5. 1 Computation Intrinsic Computational Efficiency (↜ICE) of silicon [1] is the number of 32-bit add operations per Joule, or the number of operations per second per Watt. 85€pJ in 50€nm technology. Thus, we get as intrinsic computational efficiency the following. 83 pJ) = 540 GOPS/W The ICE reflects the amount of computation that can be done within an energy envelope, but it does not measure the amount of computations per area or per volume.

The factors μT, ω and Δ are abstractions of architectural choices and features. Based on EE we define the Effective Computational Efficiency (↜ECE) as follows. tn ECEarch = 1 tn EEarch which gives the amount of computation we can do within the energy envelope of 1€J; or the amount of computations per second we can do within the power envelope of 1€W. 32 A. Jantsch et al. 1↜渀 Notation and metrics of comparison Abstraction of architectural design parameters Minimum feature size of a technology node (nm) tn Architecture of system (2D, 3D2, 3D4, 3D8, 3D16) arch ω Ratio of on- to off-chip memory (↜ω€= 1: all memory is on-chip, ω€= 0: all off-chip) Δ Memory distribution factor (Δ€= 1: all centralized memory, Δ€= 0: all local) μT Number of memory accesses per h/w operation (↜μT€= 1: one mem.

225–230, 2007. 37. P. Benkart, A. Kaiser, A. Munding, M. -J. Pfleiderer, E. Kohn, A. Heittmann, and U. Ramacher, 3D Chip Stack Technology using Through-Chip Interconnects. IEEE Design & Test of Computers, 22(6), pp. 512–518, 2005. 38. P. Gueguen, L. Di Cioccio, M. Rivoire, D. Scevola, M. M. Charvet, L. Bally, and L. Clavelier, Copper direct bonding for 3D integration. IEEE International Interconnect Technology Conference, pp. 61–63, 2008. 39. T. Osborn, A. He, H. Lightsey, and P. Kohl, All-copper chip-to-substrate interconnects.

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